Samsung to use chip making tech favoured by SK Hynix
SEOUL: Samsung Electronics plans to use a chip making technology championed by rival SK Hynix, five people said, as the world's top memory chipmaker seeks to catch up in the race to produce high-end chips used to power artificial intelligence. The demand for high bandwidth memory (HBM) chips has boomed with the growing popularity of generative AI. But Samsung, unlike peers SK Hynix and Micron Technology , has been conspicuous by its absence in any deal making with AI chip leader Nvidia to supply latest HBM chips. One of the reasons Samsung has fallen behind is its decision to stick with chip making Technology called non-conductive film (NCF) that causes some production issues, while Hynix switched to the mass reflow molded underfill (MR-MUF) method to address NCF's weakness, according to analysts and industry watchers. Samsung, however, has recently issued purchase orders for chipmaking equipment designed to handle MUF technique, three sources with direct...